Main Screen Graphical User Interface GUI Features
| The main plating line analysis management screen displays the current status of all processes by placing a symbol
next to the processes that need attention. The list box labeled “Process” shows all the processes. The
“Stations” list box shows all the stations of the process that are highlighted in the “Process” list box. The
“Components” list box shows all the components of the station that are highlighted in the “Stations” list
box. When a plating line event is almost due (user defined), a diamond symbol appears in next to the
plating line tank related item. A check mark symbol appears next to any item when the
plating line bath analysis / makeup / dump event is due and an “X” symbol indicates an event is
overdue.
A red border around these three list boxes will appear when a plating line action is overdue. The plating line event becomes overdue when it has been due for a percentage of the trigger value (user defined). Click the button above the middle text box so it shows “Show Current Events Due”. Anything due for the highlighted plating line station in the “Stations” list box will appear in this text box. Click the button above the middle text box to show “Preview Upcoming Events”. This displays any plating line bath event that is not currently due, but is scheduled for the station that is highlighted in the “Stations” list box. The “Tracking #” indicator displays the last number used for an add or make-up sheet. The “Current User” indicator displays the name of the operator that is logged on. The bottom left text box lists all plating line add and make-up sheets that have been issued and not closed out. The check mark to the left will become an X (overdue) if the plating line action is not completed before a user defined percentage of the analysis trigger value. A red border around this text box indicates that one of the entries is overdue. |
Typical Plating Line Processes used with Lab Wizard plating line lab analysis software are Automated Plating, Brown Oxide, Electroless Copper, Manual Plating, Pumice Pre-Clean, S.E.S. Line.
Typical plating line stations used with Lab Wizard Plating Line Software are 1% Sulfuric, 10% Solderon, 10% Sulfuric, 10% Sulfuric, 748 Microetch, Ammonia Etcher, Copper, Bath "A", Copper, Bath "B", Day Tank, Microetch, Oxide, Pattern Prep, PC-960 Cleaner, Post-Dip, Pre-dip, Resist Stripper, Solder Stripper.
Typical plating line components used with Lab Wizard plating
line software are 426 Surface-tech Stripper, 484 "B",
484"B", 50% HCl (High Purity), 783 Envirostrip, Besbon E-339,
Chlorides, Circuposit PB Converter, Copper, Cuposit Z, Etch Rate, Hydrogen
Peroxide, Pattern Prep 24 Make-Up Salt, PC Solderon ACID, PC-960, pH, Preposit
748, Preposit Etch 748, Specific Gravity, Sulfuric Acid, Sulfuric Acid (PC
Grade)
|
E-mail B.P.S. |
Download Manual |